Single-phase high-entropy intermetallic compounds (HEICs): bridging high-entropy alloys and ceramics
Science Bulletin2019Vol. 64(12), pp. 856–864
Citations Over TimeTop 10% of 2019 papers
Related Papers
- → Activation energies of intermetallic compound growth at interface between Sn–5Bi–3.5Ag solder and Cu substrate(2003)12 cited
- → Effect of minor addition of Pb upon interfacial reactions and mechanical properties at Sn-3.0Ag-0.5Cu/Cu and Sn-58Bi/Cu solder joints(2008)4 cited
- → Alloys Based on Intermetallic Compounds(2021)2 cited
- → 14 Intermetallic materials(2005)2 cited
- → Fabrication and Microstructure of Fe-Al Intermetallic Compound Powders by Mechanical Alloying(2010)