High Current Density in Monolayer MoS₂ Doped by AlO_x

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Abstract

Semiconductors require stable doping for applications in transistors, optoelectronics, and thermoelectrics. However, this has been challenging for two-dimensional (2D) materials, where existing approaches are either incompatible with conventional semiconductor processing or introduce time-dependent, hysteretic behavior. Here we show that low-temperature (x provides a stable n-doping layer for monolayer MoS₂, compatible with circuit integration. This approach achieves carrier densities >2 × 1013 cm-2, sheet resistance as low as ∼7 kΩ/□, and good contact resistance ∼480 Ω·μm in transistors from monolayer MoS₂ grown by chemical vapor deposition. We also reach record current density of nearly 700 μA/μm (>110 MA/cm2) along this three-atom-thick semiconductor while preserving transistor on/off current ratio >106. The maximum current is ultimately limited by self-heating (SH) and could exceed 1 mA/μm with better device heat sinking. With their 0.1 nA/μm off-current, such doped MoS₂ devices approach several low-power transistor metrics required by the international technology roadmap.

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