An Ultraviolet-Curable Mold for Sub-100-nm Lithography
Journal of the American Chemical Society2004Vol. 126(25), pp. 7744–7745
Citations Over TimeTop 1% of 2004 papers
Abstract
We describe a novel UV-curable mold that is stiff enough for replicating dense sub-100-nm features even with a high aspect ratio. It also allows for flexibility when the mold is prepared on a flexible support such that large area replication can be accomplished. The composite material of the mold is inert to chemicals and solvents. The surface energy is made low with a small amount of releasing agent such that the mold can be removed easily and cleanly after patterning. In addition, the material allows self-replication of the mold. These unique features of the mold material should make the mold quite useful for various patterning purposes.
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