Atomic layer lithography of wafer-scale nanogap arrays for extreme confinement of electromagnetic waves
Nature Communications2013Vol. 4(1), pp. 2361–2361
Citations Over TimeTop 1% of 2013 papers
Xiaoshu Chen, Hyeong‐Ryeol Park, Matthew Pelton, Xianji Piao, Nathan C. Lindquist, Hyungsoon Im, Yun Jung Kim, J. S. Ahn, Kwang Jun Ahn, Namkyoo Park, Dai‐Sik Kim, Sang‐Hyun Oh
Related Papers
- → Chemical and Mechanical Properties of Cu Surface Reaction Layers in Cu-CMP to Improve Planarization(2013)23 cited
- 0.35μm CMOS Technology with Chemical Mechanical Polishing for Three Metallization Levels Planarization(1994)
- → <title>Planarization using chemical mechanical planarization (CMP) on a 16-megabit SRAM with quadruple polysilicon stacks</title>(1994)
- Study of the Chemical-Mechanical Global Planarization of Low-k Dielectric in ULSI(2006)
- Chemical Mechanical Polishing (CMP) 공정을 이용한 Mutilevel Metal 구조의 광역 평탄화에 관한 연구(1998)