High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction
Lab on a Chip2006Vol. 6(7), pp. 936–936
Citations Over TimeTop 10% of 2006 papers
Abstract
We discuss thermoforming of thermoplastic polymers for the hot-embossing lithographic (HEL) fabrication of microfluidic chips near equilibrium conditions that minimize elastic recoil for optimal motif replication. While HEL is often simplistically described as the transfer of micro- and nano-motifs into heat-softened thermoplastic materials, we describe our rational approach to selecting appropriate processing parameters.
Related Papers
- → Hot embossing as a method for the fabrication of polymer high aspect ratio structures(2000)660 cited
- → Fabrication of aligned microstructures with a single elastomeric stamp(2002)150 cited
- → Microfluidic devices for μ -TAS applications fabricated by polymer hot embossing(1998)64 cited
- → Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry(2007)1 cited
- Fast prototyping using a dry film photoresist: microfabrication of soft-lithography masters for microfluidic structures(2007)