Patterning micron-sized features in a cross-linked poly(acrylic acid) film by a wet etching process
Soft Matter2006Vol. 3(1), pp. 108–116
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Adam Winkleman, Raquel Perez‐Castillejos, Michal Lahav, Max Narovlyansky, Leonard Rodriguez, George M. Whitesides
Abstract
This paper describes a photolithographic method to create sub-micron-scale patterns of cation-cross-linked poly(acrylic acid) (CCL-PAA). PAA can be cross-linked with a wide range of metal cations-including, but not limited to, Ag, Ca, Pd, Al, La, and Ti. Upon patterning a positive photoresist (diazonaphthoquinone-novolac resin) on a film of CCL-PAA, the exposed regions of CCL-PAA were etched by either an aqueous NaOH or EDTA solution. The initial cross-linking cation could be exchanged for a second cation that could not be patterned photolithographically. We used these patterned films of CCL-PAA i) to host and template the reduction of metallic cations to metallic nanoparticles, and ii) to fabricate porous, low- dielectric substrates.
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