Polyimides with low dielectric constants and dissipation factors at high frequency derived from novel aromatic diamines with bistrifluoromethyl pendant groups
Polymer Chemistry2023Vol. 14(33), pp. 3862–3871
Citations Over TimeTop 10% of 2023 papers
Yao Zhang, Shan Huang, Xialei Lv, Kuangyu Wang, Huimin Yin, Siyao Qiu, Jinhui Li, Guoping Zhang, Rong Sun
Abstract
Fan-out wafer-level packaging (FOWLP) urgently demands low dielectric constant and dissipation factor interlayer dielectric materials to mitigate high transmission losses at high frequencies.
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