An analytical model of strain isolation for stretchable and flexible electronics
Applied Physics Letters2011Vol. 98(6)
Citations Over TimeTop 10% of 2011 papers
Huanyu Cheng, Jian Wu, Mingwu Li, Dae‐Hyeong Kim, Y. S. Kim, Y. Huang, Zhan Kang, Keh‐Chih Hwang, John A. Rogers
Abstract
One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length.
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