Verification of wafer-level calibration accuracy at high temperatures
2008pp. 1–4
Citations Over Time
Abstract
This article presents the results of accuracy verification of wafer-level calibration at high temperatures based on coplanar calibration standards. The electrical characteristics of different commercially available coplanar calibration lines were extracted and compared at different temperatures. Finally, the accuracy of lumped calibrations at variable temperatures was verified by definition of the worst-case error bounds for the measurement of passive devices and compared to the reference NIST multiline TRL.
Related Papers
- → Reevaluation of the accuracy of NIST photmask linewidth standards(1995)8 cited
- → EVALUATION OF MEASUREMENT UNCERTAINTY AS A MANDATORY PROCEDURE WDURING CALIBRATION OF MEASURING INSTRUMENTS IN ACCORDANCE WITH THE NEW VERSION LAW OF UKRAINE "ON METROLOGY AND METROLOGICAL ACTIVITY"(2014)1 cited
- → The NIST Advanced Measurement Laboratory: at the leading edge of measurement science and technology(2006)
- → Current projects in display metrology at the NIST flat panel display laboratory(2003)
- → The measurement uncertainty evaluation of a reversal error for the ALSM(2015)