Surface temperature-aware thermal management technique for mobile devices
Citations Over Time
Abstract
Recent demand on more advanced functionalities in mobile devices has led to a drastic increase in power consumption of the device. Therefore, heat dissipation has become a major concern. To effectively overcome the thermal barrier based on the surface temperature of mobile devices, we propose a surface temperature-aware thermal management (STaTM) technique to be incorporated into a mobile application processor (AP), which plays a key role in the heat management of the mobile device. The proposed STaTM enables the AP to maximize the energy efficiency using accuracy-enhanced rapid surface temperature estimation. Experimental results show that the proposed solution achieves an average performance improvement of 14.2% when compared to conventional thermal management techniques.
Related Papers
- → Effect of junction temperature on heat dissipation of high power light emitting diodes(2016)26 cited
- → A self-consistent junction temperature estimation methodology for nanometer scale ICs with implications for performance and thermal management(2004)68 cited
- Thermal Design of GaN-based High-power LED Module(2007)
- Research progress in heat dissipation technology and materials used for high-power LED devices(2013)
- → Thermal Management, Design, and Analysis for WLCSP(2014)