John H. Lau
Micron Corporation (United States)(US)Nanya Technology (Taiwan)(TW)New York University(US)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Additive Manufacturing and 3D Printing Technologies, Electromagnetic Compatibility and Noise Suppression, Nanofabrication and Lithography Techniques
Most-Cited Works
- Flip Chip Technologies(1995)
- → Recent Advances and Trends in Advanced Packaging(2022)530 cited
- Ball Grid Array Technology(1994)
- Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies(1996)
- → Overview and outlook of through‐silicon via (TSV) and 3D integrations(2011)329 cited
- → Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps(2009)291 cited
- → Solder Joint Reliability—Theory and Applications(1992)262 cited
- → Thermal management of 3D IC integration with TSV (through silicon via)(2009)186 cited