D. Baldwin
OFS (United States)(US)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Integrated Circuits and Semiconductor Failure Analysis, Additive Manufacturing and 3D Printing Technologies, Intermetallics and Advanced Alloy Properties
Most-Cited Works
- → Characterization of a no-flow underfill encapsulant during the solder reflow process(2002)52 cited
- → Component level reliability on different dimensions of lead free wafer level chip scale packages subjected to extreme temperatures(2012)7 cited
- → Adhesion characterization of no-flow underfills used in flip chip assemblies and correlation with reliability(2001)4 cited
- → Evaluation, optimization, and reliability of no-flow underfill process(2003)4 cited