Hongjun Ji
Shenzhen Institute of Information Technology(CN)Harbin Institute of Technology(CN)Smart Material (Germany)(DE)Welding Science (Brazil)(BR)Printed Electronics (United Kingdom)(GB)Harbin Welding Institute(CN)State Key Laboratory of Advanced Welding and JoiningMinistry of Industry and Information Technology(CN)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Advanced Welding Techniques Analysis, 3D IC and TSV technologies, Advanced Sensor and Energy Harvesting Materials, Aluminum Alloys Composites Properties
Most-Cited Works
- → Ultrafast control of vortex microlasers(2020)795 cited
- → Highly Conductive Cu–Cu Joint Formation by Low-Temperature Sintering of Formic Acid-Treated Cu Nanoparticles(2016)215 cited
- → Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging(2013)170 cited
- → Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design(2023)169 cited
- → Effects of Ag content on the interfacial reactions between liquid Sn–Ag–Cu solders and Cu substrates during soldering(2016)114 cited
- → Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application(2015)103 cited