Hiroyuki Ryoson
Tokyo Institute of Technology(JP)
Publications by Year
Research Areas
3D IC and TSV technologies, Heat Transfer and Optimization, Electronic Packaging and Soldering Technologies, Heat Transfer and Boiling Studies, Thermal properties of materials
Most-Cited Works
- → Tensile and fatigue fracture behavior and water-environment effects in a SiC-whisker/7075-aluminum composite(1993)67 cited
- → Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)(2022)23 cited
- → Nano-Structured Two-Phase Heat Spreader for Cooling Ultra-High Heat Flux Sources(2010)18 cited
- → On-Chip CMOS-MEMS-Based Electroosmotic Flow Micropump Integrated With High-Voltage Generator(2019)18 cited
- → Bumpless Build Cube (BBCube): High-Parallelism, High-Heat-Dissipation and Low-Power Stacked Memory using Wafer-Level 3D Integration Process(2020)13 cited
- → Vertically Replaceable Memory Block Architecture for Stacked DRAM Systems by Wafer-on-Wafer (WOW) Technology(2020)12 cited
- → Hotspot Liquid Microfluidic Cooling: Comparing The Efficiency between Horizontal Flow and Vertical Flow(2016)8 cited
- → Electrical and Thermal Analysis of Bumpless Build Cube 3D Using Wafer-on-Wafer and Chip-on-Wafer for Near Memory Computing(2023)8 cited
- → Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy(2023)7 cited
- → A two-phase heat spreader for cooling high heat flux sources(2010)5 cited