Xinhuan Niu
Tianjin University of Technology(CN)Hebei University of Technology(CN)Shaoxing University(CN)Tiangong University(CN)Microelectronica (Romania)(RO)Institute of Microelectronics(CN)Shaanxi Yanchang Petroleum (China)(CN)Shandong Agricultural University(CN)United Microelectronics (United States)(US)
Publications by Year
Research Areas
Advanced Surface Polishing Techniques, Diamond and Carbon-based Materials Research, Integrated Circuits and Semiconductor Failure Analysis, Advanced machining processes and optimization, Corrosion Behavior and Inhibition
Most-Cited Works
- → Genome-wide analysis of basic helix-loop-helix (bHLH) transcription factors in Brachypodium distachyon(2017)149 cited
- → Study on the film forming mechanism, corrosion inhibition effect and synergistic action of two different inhibitors on copper surface chemical mechanical polishing for GLSI(2019)132 cited
- → Identification of wheat DREB genes and functional characterization of TaDREB3 in response to abiotic stresses(2020)111 cited
- → Flexible Sweat Sensors: From Films to Textiles(2023)105 cited
- → Surface action mechanism and planarization effect of sarcosine as an auxiliary complexing agent in copper film chemical mechanical polishing(2020)89 cited
- → Surface bioelectric dry Electrodes: A review(2021)87 cited