Jia Xien Chew
National University of Malaysia(MY)
Publications by Year
Research Areas
Radio Frequency Integrated Circuit Design, Microwave Engineering and Waveguides, Electronic Packaging and Soldering Technologies, Electromagnetic Compatibility and Noise Suppression, 3D IC and TSV technologies
Most-Cited Works
- → Copper Interconnections for High Performance and Fine Pitch Flipchip Digital Applications and Ultra-Miniaturized RF Module Applications(2006)33 cited
- Design of an active inductor based LNA in Silterra 130 nm CMOS process technology(2015)