Yu Kuo-Hua
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Postcolonial and Cultural Literary Studies, Contemporary Literature and Criticism, Nanofabrication and Lithography Techniques
Most-Cited Works
- → Analysis of Warpage and Stress Behavior in a Fine Pitch Multi-Chip Interconnection with Ultrafine-Line Organic Substrate (2.1D)(2018)23 cited
- Time, Chance and Space: Stan Lai’s Newest Work, Ago(2020)