Gaurav Mehrotra
Renesas Electronics (United States)(US)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Semiconductor Lasers and Optical Devices, Copper Interconnects and Reliability, Electrochemical sensors and biosensors
Most-Cited Works
- → Copper Interconnections for High Performance and Fine Pitch Flipchip Digital Applications and Ultra-Miniaturized RF Module Applications(2006)33 cited
- → Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF(2009)24 cited
- → Highly Reliable and Manufacturable Ultrafine Pitch Cu–Cu Interconnections for Chip-Last Embedding With Chip-First Benefits(2012)8 cited
- → Low-temperature, fine-pitch interconnections using self-patternable metallic nanoparticles as the bonding layer(2008)6 cited
- → Ferrite-Based NFC Antenna and Sensor Package Module Development for Implantable Continuous Glucose Monitor(2024)2 cited
- Ultra thin ultrafine-pitch chip-package interconnections for embedded chip last approach(2008)
- Improving Health Care with a Virtual Human Sleep Coach(2011)
- → Microwave design & characterization of a novel Nano-Cu based ultra-fine pitch chip-to-package interconnect(2008)
- → Design, Materials Selection, and Assembly Process for a CMUT-Based Handheld Ultrasound Probe Head: Overcoming Development Challenges(2025)
- → World’s Smallest, Membrane-Based Capacitive Differential Pressure Sensor-Package Structure, Material Selection, Assembly Challenges and Solutions(2024)