R. Döring
Fraunhofer Institute for Electronic Nano Systems(DE)Micro Materials (United Kingdom)(GB)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Silicon Carbide Semiconductor Technologies, Aluminum Alloys Composites Properties, Advanced Measurement and Metrology Techniques
Most-Cited Works
- → Combined experimental- and FE-studies on sinter-Ag behaviour and effects on IGBT-module reliability(2014)31 cited
- → Fatigue Life Prediction and Analysis of Wafer Level Packages with SnAgCu Solder Balls(2006)23 cited
- → Electro-thermo-mechanical analyses on silver sintered IGBT-module reliability in power cycling(2015)16 cited
- → Do chip size limits exist for DCA?(1999)11 cited
- → Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue(2018)10 cited
- → Studies on Thermo-Mechanical Reliability of High Performance Vehicle Computers Based on a Mock-up System(2021)9 cited