Hung-Ho Lee
Siliconware Precision Industries (Taiwan)(TW)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Advanced Welding Techniques Analysis, Metallurgy and Material Forming, Advancements in Photolithography Techniques, 3D IC and TSV technologies
Most-Cited Works
- → Process Induced Wafer Warpage Optimization for Multi-chip Integration on Wafer Level Molded Wafer(2019)4 cited
- Logic design of the Flaw Evaluation in the Rolling stock axle for Phassed Array ultrasonic inspection method(2008)