Min Ding
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Copper Interconnects and Reliability, Advanced Welding Techniques Analysis, Intermetallics and Advanced Alloy Properties
Most-Cited Works
- → Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints(2006)121 cited
- → Reliability issues for flip-chip packages(2004)81 cited
- → Effect of contact metallization on electromigration reliability of Pb-free solder joints(2006)80 cited
- → Multi-functional and integrated actuators made with bio-inspired cobweb carbon nanotube–Polymer composites(2022)53 cited
- → Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages(2007)53 cited
- → Achieving high reliability low cost lead-free SAC solder joints via Mn or Ce doping(2009)44 cited
- → Microstructure-Based Stress Modeling of Tin Whisker Growth(2006)39 cited
- → Thermal deformation analysis on flip-chip packages using high resolution moire interferometry(2003)28 cited
- → Effects of reflow on the microstructure and whisker growth propensity of Sn finish(2005)22 cited