Kambiz Samadi
Qualcomm (United States)(US)
Publications by Year
Research Areas
3D IC and TSV technologies, VLSI and FPGA Design Techniques, Interconnection Networks and Systems, Low-power high-performance VLSI design, VLSI and Analog Circuit Testing
Most-Cited Works
- → ORION 2.0: A fast and accurate NoC power and area model for early-stage design space exploration(2009)532 cited
- → ORION 2.0: A Power-Area Simulator for Interconnection Networks(2011)253 cited
- → SnaPEA: Predictive Early Activation for Reducing Computation in Deep Convolutional Neural Networks(2018)177 cited
- → Design and CAD methodologies for low power gate-level monolithic 3D ICs(2014)118 cited
- → Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs(2017)88 cited
- → CMP Fill Synthesis: A Survey of Recent Studies(2007)82 cited
- → FlexiGAN: An End-to-End Solution for FPGA Acceleration of Generative Adversarial Networks(2018)71 cited
- → High-density integration of functional modules using monolithic 3D-IC technology(2013)68 cited
- → BEOL stack-aware routability prediction from placement using data mining techniques(2016)66 cited
- → GAN-CTS: A Generative Adversarial Framework for Clock Tree Prediction and Optimization(2019)64 cited