E. Poppe
SINTEF(NO)SINTEF Digital
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Advanced MEMS and NEMS Technologies, Photonic Crystal and Fiber Optics, Copper Interconnects and Reliability
Most-Cited Works
- → AlAl thermocompression bonding for wafer-level MEMS sealing(2014)56 cited
- → High-power (400 mW) diode-pumped 2.7 µm Er:ZBLANfibre lasers usingenhanced Er-Er cross-relaxation processes(1999)46 cited
- → Wafer-level Au–Au bonding in the 350–450 °C temperature range(2014)34 cited
- → Anodic bonding of glass to aluminium(2005)27 cited
- → 980 nm diode-pumped continuous wave mid-IR (2.7µm) fibre laser(1998)25 cited
- → Impact of SiO2on Al–Al thermocompression wafer bonding(2015)24 cited
- → Tuning of resist slope with hard-baking parameters and release methods of extra hard photoresist for RF MEMS switches(2007)20 cited
- → Interfacial characterization of Al-Al thermocompression bonds(2016)18 cited
- → Fabrication process for CMUT arrays with polysilicon electrodes, nanometre precision cavity gaps and through-silicon vias(2012)15 cited
- → Anisotropic conductive film interconnects for fine-pitch MEMS(2012)8 cited