I. Artaki
AT&T (United States)(US)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Advanced Welding Techniques Analysis, Material Dynamics and Properties, Glass properties and applications
Most-Cited Works
- → NMR and Raman study of the hydrolysis reaction in sol-gel processes(1985)156 cited
- → Study of polymerization processes in acid and base catalyzed silica sol-gels(1986)123 cited
- → Solvent effects on the condensation stage of the sol-gel process(1986)107 cited
- → Effect of formamide additive on the chemistry of silica sol-gels II. Gel structure(1988)99 cited
- → Evaluation of Lead- Free Solder Joints in Electronic Assemblies(1994)89 cited
- → 29Si NMR study of the initial stage of the sol-gel process under high pressure(1985)68 cited
- → Pressure effect on the coupling between rotational and translational motions of supercooled viscous fluids(1985)47 cited
- → Solvent effects on hydrolysis stage of the sol-gel process(1985)47 cited
- → Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies(2002)25 cited
- → Pressure effect on the polymerization kinetics of sol-gel process(1984)21 cited