Avram Bar‐Cohen
Intel (United States)(US)Poughkeepsie Public Library District(US)Marko-Kolor (Poland)(PL)MicroVision (United States)(US)Gorgias Press (United States)(US)Broadcom (United States)(US)Marvell (United States)(US)Auburn University(US)
Publications by Year
Research Areas
Heat Transfer and Optimization, Heat Transfer and Boiling Studies, Electronic Packaging and Soldering Technologies, Thermal properties of materials, 3D IC and TSV technologies
Most-Cited Works
- → Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates(1984)538 cited
- Thermal Analysis and Control of Electronic Equipment(1983)
- → Direct Liquid Cooling of High Flux Micro and Nano Electronic Components(2006)249 cited
- → Thermal Management of On-Chip Hot Spot(2012)192 cited
- → Superlattice-based thin-film thermoelectric modules with high cooling fluxes(2016)189 cited
- Design and analysis of heat sinks(1995)
- → Design of Optimum Plate-Fin Natural Convective Heat Sinks(2003)175 cited
- → Nanothermal Interface Materials: Technology Review and Recent Results(2015)135 cited