Andy Fan
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Biosensors and Analytical Detection, Copper Interconnects and Reliability, SARS-CoV-2 detection and testing
Most-Cited Works
- → Copper Wafer Bonding(1999)211 cited
- → Paper-Based RNA Extraction, in Situ Isothermal Amplification, and Lateral Flow Detection for Low-Cost, Rapid Diagnosis of Influenza A (H1N1) from Clinical Specimens(2015)184 cited
- → Morphology and Bond Strength of Copper Wafer Bonding(2003)163 cited
- → Technology, performance, and computer-aided design of three-dimensional integrated circuits(2004)141 cited
- → Fabrication technologies for three-dimensional integrated circuits(2003)127 cited
- → Low concentration DNA extraction and recovery using a silica solid phase(2017)112 cited
- → Microstructure evolution and abnormal grain growth during copper wafer bonding(2002)103 cited
- → A progesterone biosensor derived from microbial screening(2020)87 cited
- → Paper-based molecular diagnostic for Chlamydia trachomatis(2014)82 cited
- → Contact Resistance Measurement of Bonded Copper Interconnects for Three-Dimensional Integration Technology(2004)76 cited