Long Wen
Shandong Jianzhu University(CN)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Structural Behavior of Reinforced Concrete, High-Velocity Impact and Material Behavior, Seismic Performance and Analysis
Most-Cited Works
- → Seismic performance of precast shear wall with sleeves connection based on experimental and numerical studies(2017)155 cited
- → Effect of laser shock peening on corrosion resistance of 316L stainless steel laser welded joint(2019)49 cited
- → Mechanical properties and joint reliability improvement of Sn-Bi alloy(2011)31 cited
- → Pseudodynamic tests with substructuring of a full‐scale precast box‐modularized structure made of reinforced concrete shear walls(2017)31 cited
- → Dynamic properties testing of solders and modeling of electronic packages subjected to drop impact(2008)10 cited
- → The effect of strain rate and strain range on bending fatigue test(2008)7 cited
- → Investigation of package warpage effect on TC solder joint reliability(2010)5 cited
- → Study of isothermal bending fatigue test(2009)2 cited
- → System level drop reliability method research for netbook memory module(2010)1 cited
- → Investigation on TSOP warpage mechanism and improvement method(2009)1 cited