Trent Uehling
NXP (Germany)(DE)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability, Integrated Circuits and Semiconductor Failure Analysis, Embedded Systems Design Techniques
Most-Cited Works
- → Effect of contact metallization on electromigration reliability of Pb-free solder joints(2006)80 cited
- → Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages(2007)53 cited
- → Electromigration Lifetime Statistics for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages(2006)20 cited
- → A study of electromigration failure in PB-free solder joints(2005)18 cited
- → Integration of a mechanically reliable 65-nm node technology for low-k and ULK interconnects with various substrate and package types(2005)17 cited
- → An evaluation of electromigration performance of SnPb and Pb-free flip chip solder joints(2005)10 cited
- → Intermetallic Growth and Void Formation Mechanism in Flip Chip Copper Pillar Interconnects: Role of the Underfill Material(2021)7 cited
- → Effects of UBM thickness, contact trace structure and solder joint scaling on electromigration reliability of Pb-free solder joints(2008)6 cited
- → Experimental Measurement of the Thermal Performance of a Two-Die 3D Integrated Circuit (3D IC)(2013)2 cited