Chuan Seng Tan
Chongqing University of Science and Technology(CN)Nanyang Technological University(SG)
Publications by Year
Research Areas
Photonic and Optical Devices, 3D IC and TSV technologies, Semiconductor materials and devices, Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability
Most-Cited Works
- → Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol(2009)179 cited
- → Wafer Level 3-D ICs Process Technology(2008)176 cited
- → Morphology and Bond Strength of Copper Wafer Bonding(2003)163 cited
- → Technology, performance, and computer-aided design of three-dimensional integrated circuits(2004)141 cited
- → High-efficiency GeSn/Ge multiple-quantum-well photodetectors with photon-trapping microstructures operating at 2 µm(2020)105 cited
- → Microstructure evolution and abnormal grain growth during copper wafer bonding(2002)103 cited
- → Condition Monitoring of DC-Link Capacitors Using Goertzel Algorithm for Failure Precursor Parameter and Temperature Estimation