Daniel Ismael
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Advanced Surface Polishing Techniques, Electromagnetic Compatibility and Noise Suppression, Copper Interconnects and Reliability
Most-Cited Works
- → Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications(2016)125 cited
- → Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package(2017)29 cited
- → Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking(2014)13 cited
- Implementación de una matriz de control energético en el área de producción de la compañía Eternit Ecuatoriana S.A.(2019)