Rao Tummala
Georgia Institute of Technology(US)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Electromagnetic Compatibility and Noise Suppression, Copper Interconnects and Reliability, Semiconductor Lasers and Optical Devices
Most-Cited Works
- → Microelectronics Packaging Handbook(1997)1,149 cited
- Fundamentals of Microsystems Packaging(2001)
- → Ceramic and Glass‐Ceramic Packaging in the 1990s(1991)739 cited
- → Assessing and managing risks using the Supply Chain Risk Management Process (SCRMP)(2011)617 cited
- → A Review of SiC Power Module Packaging Technologies: Challenges, Advances, and Emerging Issues(2019)459 cited
- → ZnO Nanobelt/Nanowire Schottky Diodes Formed by Dielectrophoresis Alignment across Au Electrodes(2006)356 cited
- → SOP: What Is It and Why? A New Microsystem-Integration Technology Paradigm-Moore's Law for System Integration of Miniaturized Convergent Systems of the Next Decade(2004)