D. Temple
RTI International(US)
Publications by Year
Research Areas
3D IC and TSV technologies, Semiconductor materials and devices, Electronic Packaging and Soldering Technologies, Thin-Film Transistor Technologies, Copper Interconnects and Reliability
Most-Cited Works
- → Macroelectronics: Perspectives on Technology and Applications(2005)352 cited
- → Highly flexible transparent electrodes for organic light-emitting diode-based displays(2004)265 cited
- → Recent progress in field emitter array development for high performance applications(1999)230 cited
- → Chemical Vapor Deposition of Copper from Copper (II) Hexafluoroacetylacetonate(1989)127 cited
- → Deep Neural Networks and Transfer Learning for Food Crop Identification in UAV Images(2020)93 cited
- → Development and evaluation of bend‐testing techniques for flexible‐display applications(2005)73 cited
- → Wafer-Level Vacuum Packaging of Smart Sensors(2016)72 cited