Chong Ser Choong
Agency for Science, Technology and Research(SG)Institute of Microelectronics(SG)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Photonic and Optical Devices, Additive Manufacturing and 3D Printing Technologies, Semiconductor Lasers and Optical Devices
Most-Cited Works
- → Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications(2016)125 cited
- → Comprehensive Investigation of Die Shift in Compression Molding Process for 12 Inch Fan-Out Wafer Level Packaging(2016)29 cited
- → Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package(2017)29 cited
- → Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages(2014)23 cited
- → A novel electrically conductive wafer through hole filled vias interconnect for 3D MEMS packaging(2004)22 cited
- → A Heterogeneously Integrated Wafer-level Processed Co-Packaged Optical Engine for Hyper-scale Data Centres(2023)21 cited