Allan Beikmohamadi
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Electrical and Thermal Properties of Materials, Integrated Circuits and Semiconductor Failure Analysis, Microwave Engineering and Waveguides
Most-Cited Works
- → Tacky Dots/sup TM/ transfer of solder spheres for flip chip and electronic package applications(2002)7 cited
- → Plating reliability and high frequency testing of DuPont™ GreenTape™ 9K7 LTCC(2013)2 cited
- → Tacky Dots/sup TM/ technology for flip chip and BGA solder bumping(2002)1 cited
- → Electroplating and Electroless Plating Process Development for DuPont™ GreenTape™ 9K7 LTCC(2013)1 cited
- → A 10 MHz to 80 GHz BGA Transition from Chip to LTCC Interposer for Chip Scale Packages(2015)
- → Reliability of LTCC using Electroless Nickel Immersion Gold (ENIG) Plating Technology(2014)
- → Development of a Novel No‐clean Low Residue Solder Paste for Fine Pitch Applications(1994)
- → Effect of post-reflow no-clean solder paste residue on electrical performance(1993)