Huang-Lin Chao
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Copper Interconnects and Reliability, Nanofabrication and Lithography Techniques, 3D IC and TSV technologies, Surface Modification and Superhydrophobicity
Most-Cited Works
- → Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages(2006)38 cited
- → Electromigration Lifetime Statistics for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages(2006)20 cited
- → Multi-level step and flash imprint lithography for direct patterning of dielectrics(2006)14 cited
- → Photocurable silicon-based materials for imprinting lithography(2007)10 cited
- → Kinetic Analysis of Current Enhanced Intermetallic Growth and Its Effect on Electromigration Reliability of Solder Joints(2006)6 cited
- Electromigration enhanced kinetics of Cu-Sn intermetallic compounds in Pb free solder joints and Cu low-k dual damascene processing using step and flash imprint lithography(2009)
- → OS01W0265 Photoelastic investigation of modified hertz contact theory(2003)