Laura Spinella
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Silicon and Solar Cell Technologies, Copper Interconnects and Reliability, Photovoltaic System Optimization Techniques
Most-Cited Works
- → Glass/glass photovoltaic module reliability and degradation: a review(2021)75 cited
- → Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects(2013)67 cited
- → Chemical and mechanical interfacial degradation in bifacial glass/glass and glass/transparent backsheet photovoltaic modules(2022)34 cited
- → Electrochemical degradation modes in bifacial silicon photovoltaic modules(2021)29 cited
- → FTIR Investigation of EVA Chemical Bonding Environment and Its Impact on Debond Energy(2019)20 cited
- → Thermomechanical fatigue resistance of low temperature solder for multiwire interconnects in photovoltaic modules(2021)18 cited
- → Synchrotron X-Ray Microdiffraction Investigation of Scaling Effects on Reliability for Through-Silicon Vias for 3-D Integration(2019)15 cited
- → UV-Fluorescence Imaging of Silicon PV Modules After Outdoor Aging and Accelerated Stress Testing(2020)12 cited
- → Effect of scaling copper through-silicon vias on stress and reliability for 3D interconnects(2016)11 cited
- → Processing Effect on Via Extrusion for TSVs in Three-Dimensional Interconnects: A Comparative Study(2016)11 cited