K. N. Tu
Shanghai Medical College of Fudan University(CN)National Yang Ming Chiao Tung University(TW)City University of Hong Kong(HK)Shanghai Jiao Tong University(CN)National Tsing Hua University(TW)ShanghaiTech University(CN)Zhongshan Hospital(CN)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Semiconductor materials and interfaces, Copper Interconnects and Reliability, 3D IC and TSV technologies, Semiconductor materials and devices
Most-Cited Works
- → Tin–lead (SnPb) solder reaction in flip chip technology(2001)588 cited
- → Growth kinetics of planar binary diffusion couples: ’’Thin-film case’’ versus ’’bulk cases’’(1982)566 cited
- → Kinetics of interfacial reaction in bimetallic CuSn thin films(1982)466 cited
- → Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability(2004)436 cited
- → Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper(2008)400 cited
- → Nanoscale Joule Heating and Electromigration Enhanced Ripening of Silver Nanowire Contacts(2014)392 cited