E.I. Stromswold
University of Rochester(US)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Fatigue and fracture mechanics, Advanced Welding Techniques Analysis, 3D IC and TSV technologies, Engineering Structural Analysis Methods
Most-Cited Works
- → Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints(1996)82 cited
- → Mode I fracture toughness testing of eutectic Sn-Pb solder joints(1994)55 cited
- → The effect of substrate surface roughness on the fracture toughness of Cu/96.5Sn-3.5Ag solder joints(1994)12 cited
- → An engineering tool for fracture toughness testing(1992)7 cited
- → Capillary soldering system for the material property characterization of solder joints(1993)4 cited
- → The effect of loading rate on chevron notch fracture toughness measurements(1994)1 cited
- → Reply to L. P. Poor's discussion of “an engineering tool for fracture toughness testing” by E. I. Stromswold and D. J. Quesnel(1993)1 cited