P. Markondeya Raj
Florida International University(US)
Publications by Year
Research Areas
3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Electromagnetic Compatibility and Noise Suppression, Semiconductor materials and devices, Advanced Antenna and Metasurface Technologies
Most-Cited Works
- → Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Package With Through-Glass Vias(2020)84 cited
- → First Demonstration of Compact, Ultra-Thin Low-Pass and Bandpass Filters for 5G Small-Cell Applications(2018)74 cited
- → Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications(2003)74 cited
- → Broadband and Miniaturized Antenna-in-Package (AiP) Design for 5G Applications(2020)61 cited
- → Trend from ICs to 3D ICs to 3D systems(2009)57 cited
- → Antenna miniaturization using magneto-dielectric substrates(2009)41 cited
- → Reliability of Copper Through-Package Vias in Bare Glass Interposers(2017)39 cited
- → Ultralow-Loss Substrate-Integrated Waveguides in Glass-Based Substrates for Millimeter-Wave Applications(2020)39 cited
- → Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications(2020)36 cited
- → Miniaturized High-Performance Filters for 5G Small-Cell Applications(2018)34 cited