Fei Qin
Zhejiang Chinese Medical University(CN)Guangzhou University of Chinese Medicine(CN)Beijing Institute of Technology(CN)Harbin Engineering University(CN)Chongqing University(CN)Northwestern Polytechnical University(CN)China Mobile (China)(CN)Guangdong Pharmaceutical University(CN)Dalian Medical University(CN)Beijing University of Technology(CN)Second Affiliated Hospital of Chongqing Medical University(CN)Institute of Electronics(CN)Aero Engine Corporation of China (China)(CN)Chongqing Medical University(CN)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Advanced Surface Polishing Techniques, Aluminum Alloys Composites Properties, Silicon Carbide Semiconductor Technologies
Most-Cited Works
- → User-centric ultra-dense networks for 5G: challenges, methodologies, and directions(2016)365 cited
- → Mechanical behavior of 3D printed mortar with recycled sand at early ages(2020)166 cited
- → Template-Free Preparation of Mesoporous Fe2O3 and Its Application as Absorbents(2008)151 cited
- → Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates(2014)106 cited
- → A predictive model of grinding force in silicon wafer self-rotating grinding(2016)101 cited
- → Analytical prediction for depth of subsurface damage in silicon wafer due to self-rotating grinding process(2019)79 cited