Katsuaki Suganuma
The University of Osaka(JP)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Aluminum Alloys Composites Properties, Nanomaterials and Printing Technologies, Advanced ceramic materials synthesis
Most-Cited Works
- → Advances in lead-free electronics soldering(2001)724 cited
- → Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints(2003)607 cited
- → Fabrication of silver nanowire transparent electrodes at room temperature(2011)564 cited
- → Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys(2002)375 cited
- → High-temperature lead-free solders: Properties and possibilities(2009)344 cited
- → Transparent, Conductive, and Printable Composites Consisting of TEMPO-Oxidized Nanocellulose and Carbon Nanotube(2013)293 cited