Ding Mian Zhi
Agency for Science, Technology and Research(SG)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Additive Manufacturing Materials and Processes, Legal and Regulatory Analysis, Linguistic, Cultural, and Literary Studies
Most-Cited Works
- → Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications(2016)125 cited
- → Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package(2017)29 cited
- → High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging(2016)13 cited
- Study on pore pressure and microstructure of frozen and thawed soft soil under subway cyclic loading(2016)
- → Process characterization of highly conductive silver paste die attach materials for thin die on QFN(2012)10 cited
- → MEMS WLCSP development using vertical interconnection(2016)6 cited
- → DISLOCATION CONFIGURATION IN DZ125 Ni-BASED SUPERALLOY AFTER HIGH TEMPERATURE STRESS RUPTURE(2011)4 cited
- STUDY OF YIELD CRITERION FOR SINGLE CRYSTAL NICKEL-BASED SUPERALLOYS(2004)
- → Design and optimization of molding process for MEMS WLSCP(2016)2 cited
- → Thermo-mechanical design of fan-out wafer level package for power converter module(2017)2 cited