Yanhong Tian
Beijing University of Chemical Technology(CN)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Advanced Welding Techniques Analysis, Nanomaterials and Printing Technologies, Advanced Sensor and Energy Harvesting Materials
Most-Cited Works
- → Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging(2007)240 cited
- → One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices(2016)170 cited
- → Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock(2017)114 cited
- → Flexible Electronic Systems via Electrohydrodynamic Jet Printing: A MnSe@rGO Cathode for Aqueous Zinc-Ion Batteries(2023)107 cited
- → The Mechanisms of Resistance Spot Welding of Magnesium to Steel(2010)97 cited
- → Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy(2020)94 cited
- → Recent progress in polyaniline-based chemiresistive flexible gas sensors: design, nanostructures, and composite materials(2024)94 cited
- → Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device(2020)93 cited
- → Formation mechanism and orientation of Cu3Sn grains in Cu–Sn intermetallic compound joints(2013)82 cited
- → A Layered Bi2Te3@PPy Cathode for Aqueous Zinc‐Ion Batteries: Mechanism and Application in Printed Flexible Batteries(2023)76 cited