R. E. Pratt
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, Aluminum Alloy Microstructure Properties, Advanced Welding Techniques Analysis, Catalysis and Hydrodesulfurization Studies, 3D IC and TSV technologies
Most-Cited Works
- → Effect of solid-state intermetallic growth on the fracture toughness of Cu/63Sn-37Pb solder joints(1996)82 cited
- → Mode I fracture toughness testing of eutectic Sn-Pb solder joints(1994)55 cited
- → Measurements and Analysis(2002)15 cited
- → The effect of substrate surface roughness on the fracture toughness of Cu/96.5Sn-3.5Ag solder joints(1994)12 cited
- → Capillary soldering system for the material property characterization of solder joints(1993)4 cited
- → Fluid Cracking Catalyst ZSM-5 Additive Performance at Overcracking Mode(1994)3 cited
- Heavy oil hydroprocessing(1995)
- → Contributors(2002)