Fengjiang Wang
Sun Yat-sen University(CN)Sixth Affiliated Hospital of Sun Yat-sen University(CN)Jiangsu University of Science and Technology(CN)Division of Materials Science and Engineering(AU)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Advanced Welding Techniques Analysis, Intermetallics and Advanced Alloy Properties, Aluminum Alloys Composites Properties
Most-Cited Works
- → Structure- and Reactivity-Based Development of Covalent Inhibitors of the Activating and Gatekeeper Mutant Forms of the Epidermal Growth Factor Receptor (EGFR)(2013)258 cited
- → Recent progress on the development of Sn–Bi based low-temperature Pb-free solders(2019)200 cited
- → Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints(2017)118 cited
- → Development of Cu–Sn intermetallic compound at Pb-free solder/Cu joint interface(2003)116 cited
- → Ultrasonic welding of fiber reinforced thermoplastic composites: Current understanding and challenges(2021)83 cited
- → Development of lead-free interconnection materials in electronic industry during the past decades: Structure and properties(2022)74 cited