C.Y. Chan
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Aluminum Alloys Composites Properties, Semiconductor materials and interfaces, Aluminum Alloy Microstructure Properties
Most-Cited Works
- → Cu wire bond microstructure analysis and failure mechanism(2010)62 cited
- → OpenAI o1 System Card(2024)34 cited
- → The effect of tin grain structure on whisker growth(2010)28 cited
- → Characterization of Intermetallic Compound Formation and Copper Diffusion of Copper Wire Bonding(2006)15 cited
- → Effects of Al Pad Deformation and TiW Barrier Layer on Copper-to-Silicon Diffusion and Intermetallic Compound Formation in Copper Wire Bonding(2006)5 cited
- Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding(2007)