A. Deutsch
IBM Research - Thomas J. Watson Research Center(US)
Publications by Year
Research Areas
Electromagnetic Compatibility and Noise Suppression, 3D IC and TSV technologies, Low-power high-performance VLSI design, Electronic Packaging and Soldering Technologies, Microwave and Dielectric Measurement Techniques
Most-Cited Works
- → When are transmission-line effects important for on-chip interconnections?(1997)383 cited
- → Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection(2005)236 cited
- → On-chip wiring design challenges for gigahertz operation(2001)213 cited
- → High-speed signal propagation on lossy transmission lines(1990)207 cited
- → Electrical characteristics of interconnections for high-performance systems(1998)177 cited
- → Modeling and characterization of long on-chip interconnections for high-performance microprocessors(1995)174 cited
- → An Overview of the BlueGene/L Supercomputer(2002)159 cited