Lakshmi N. Ramanathan
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Copper Interconnects and Reliability, Intermetallics and Advanced Alloy Properties, Integrated Circuits and Semiconductor Failure Analysis
Most-Cited Works
- → Spalling of Cu3Sn intermetallics in high-lead 95Pb5Sn solder bumps on Cu under bump metallization during solid-state annealing(2004)62 cited
- → Electromigration statistics and damage evolution for Pb-free solder joints with Cu and Ni UBM in plastic flip-chip packages(2007)53 cited
- → Solid-state annealing behavior of two high-Pb solders, 95Pb5Sn and 90Pb10Sn, on Cu under bump metallurgy(2005)39 cited
- → Emerging reliability challenges in electronic packaging(2008)26 cited
- → Electromigration Lifetime Statistics for Pb-Free Solder Joints with Cu and Ni UBM in Plastic Flip-Chip Packages(2006)20 cited
- → Electromigration behavior of lead-free solder flip chip bumps on NiP/Cu metallization(2008)13 cited
- → Secondary Current Crowding Effect during Electromigration of Flip-Chip Solder Joints(2007)11 cited
- → Implementation of a mobile phone module with redistributed chip packaging(2008)11 cited
- → Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power Applications(2007)7 cited