Ranee W. Kwong
IBM (United States)(US)
Publications by Year
Research Areas
Advancements in Photolithography Techniques, Nanofabrication and Lithography Techniques, Semiconductor materials and devices, Advanced Surface Polishing Techniques, Copper Interconnects and Reliability
Most-Cited Works
- → Effect of thin-film imaging on line edge roughness transfer to underlayers during etch processes(2004)86 cited
- → Recent progress in electron-beam resists for advanced mask-making(2001)40 cited
- → Evaluation of a new environmentally stable positive tone chemically amplified deep-UV resist(1994)14 cited
- → Impact of thin resist processes on post-etch LER(2003)13 cited
- → Rational design in cyclic olefin resists for sub-100-nm lithography(2003)11 cited
- → 193nm single layer photoresists: defeating tradeoffs with a new class of fluoropolymers(2005)11 cited
- → Sensitivity enhancers for chemically amplified resists(1990)9 cited
- → Reactive ion etch studies of DUV resists(1999)7 cited
- → Fluoroalcohol-Methacrylate Resists for 193nm Lithography(2005)6 cited
- → High-performance 193-nm photoresist materials based on a new class of polymers containing spaced ester finctionalities(2003)6 cited