Hiroshi Nishikawa
Fujitsu (Japan)(JP)Osaka Research Institute of Industrial Science and Technology(JP)Chukyo Hospital(JP)Nagasaki University(JP)Tokushima University(JP)The University of Osaka(JP)Osaka University(JP)
Publications by Year
Research Areas
Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies, Aluminum Alloys Composites Properties, Advanced Welding Techniques Analysis, Intermetallics and Advanced Alloy Properties
Most-Cited Works
- → Boron nitride as a lubricant additive(1999)326 cited
- → Experimental Protection of Mice against Lethal Staphylococcus aureus Infection by Novel Bacteriophage φMR11(2003)260 cited
- → Posterior calvarial vault expansion using distraction osteogenesis(2008)208 cited
- → Effects of Co and Ni addition on reactive diffusion between Sn–3.5Ag solder and Cu during soldering and annealing(2006)194 cited
- → Mechanism of Action of T-705 Ribosyl Triphosphate against Influenza Virus RNA Polymerase(2013)186 cited
- → Correlation between microstructure and mechanical properties of Sn–Bi–X solders(2015)149 cited